PLATINGPRODUCT
globalsix
2017-12-06T14:12:06+00:00
1.Plating Material : Cu
2.Wafer Size : 2’’ ~ 8’’
3.Capacity; >> 1000 wafers/day
4.Customized for CSP applications
1.Plating Material : Ni, Au
2.Wafer Size : 2’’ ~ 8’’
3.Capacity; >> 1000 wafers/day
4.Customized
