도금 장비

PLATINGPRODUCT 2017-12-06T14:12:06+00:00

도금장비

1.Plating Material  : Cu
2.Wafer Size : 2’’ ~ 8’’
3.Capacity; >> 1000 wafers/day
4.Customized for CSP applications
1.Plating Material  : Ni, Au
2.Wafer Size : 2’’ ~ 8’’
3.Capacity; >> 1000 wafers/day
4.Customized